• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The utility model is for an integrated heat sink connection row module, where the connection row is equipped with a double-sided, melt processable heat sink including a base and vanes, where the fins extend from the base, and a molded case circuit breaker with an integrated heat sink connection row module, where the connection row is equipped with a plastic heat sink, melt processable , double-sided, comprising a base and fins, where the fins extend from the base.
    公开号:FR3027186A3
    申请号:FR1559558
    申请日:2015-10-08
    公开日:2016-04-15
    发明作者:Cheng Liu
    申请人:DSM IP Assets BV；
    IPC主号:
    专利说明:

    [0001] Integrated Heatsink Attached Array Module TECHNICAL FIELD The utility model is a built-in plastic heatsink connection stub module, suitable for use with a current molded case circuit breaker (MCCB). continued. It also relates to a MCCB comprising such an integrated plastic heat sink connection row module. TECHNICAL BACKGROUND A circuit breaker as defined by the IEC60947 standard is generally used to pass or interrupt an electric current that is for example generated by a terminal of a three-phase power source. An advantage over the use of fuses is that the fuses can only be used once and must be replaced if the circuit is interrupted. If a fault in the electrical current is detected, a cut-off signal is transmitted to cut off the power supply.
    [0002] All circuit breaker systems have common features in operation, although details vary significantly depending on the voltage class, rated current, and type of circuit breaker. The circuit breaker must detect a fault condition; in low-voltage circuit breakers, this is usually done in the circuit-breaker's protective box.
    [0003] Circuit breakers for large currents or high voltages are generally arranged with protective relay control devices to detect a fault condition and operate an opening trip mechanism. Once a fault is detected, the contacts in the circuit breaker must open to interrupt the circuit; some mechanically stored energy (using elements such as springs or compressed air) contained in the circuit breaker is used to separate the contacts, although a certain amount of the required energy can be obtained from the fault current itself. Small circuit breakers can be operated manually; larger units have solenoids to trigger the mechanism and electric motors to power the springs.
    [0004] The circuit breaker contacts must be able to carry electrical current without excessive heating and must also withstand the heat of the arc produced during the interruption (opening) of the circuit. The contacts are usually copper or copper alloys, silver alloys and other highly conductive materials.
    [0005] 1 3027186 When a current is interrupted, an arc is generated. This arc must be controlled, cooled and extinguished in a controlled manner, so that the gap between the contacts can again resist the voltage in the circuit. Different circuit breakers use vacuum, air, insulating gas or insulating oil as the medium in which the arc is formed.
    [0006] The medium voltage circuit breakers may be connected in the circuit by screwed connections, for example to distribution bars or connection rows equipped with a heat sink. In the distribution of electrical energy, a distribution bar is a strip or bar of copper, brass or aluminum that conducts electricity in a control panel, a distribution board, a substation, a group of batteries or other electrical equipment. Its main purpose is to conduct a large electrical current, its transverse dimension determining the maximum amount of current that can be safely transported, and not to function as a structural element. A connection row is an example of a distribution bar that can be used in an MCCB.
    [0007] In electronic systems, a heat sink is a passive heat exchanger that cools a device by dissipating heat into the surrounding environment. In computers, heat sinks are used to cool CPUs or graphics processors. Heat sinks are used with high power semiconductor devices, such as power transistors and optoelectronic devices, such as lasers and light-emitting diodes (LEDs), where the heat dissipation capability of the base device is insufficient to moderate its temperature. A heat sink is designed to maximize the extent of its surface in contact with the surrounding cooling medium, such as air. Air velocity, material choice, protrusion design, and surface treatment are factors that influence the performance of a heat sink. Heat sinks generally include a base with fins extending from the base. There are many ways to attach a heatsink to a connection row and these include the use of at least one screw and / or heat-conducting glue to secure the heatsink. Thermal adhesive or thermal grease can improve the performance of the heat sink by filling the air gaps between the heat sink and the device. A variant of the heat sink with straight fins is a heat sink with flared fins. A finned pin heat sink is a heat sink that has pins extending from its base. The pins can be cylindrical, elliptical or square.
    [0008] 2 3027186 In general, the larger the surface area of a heat sink, the better it works. In general, the higher the thermal conductivity of a heat sink, the better it works.
    [0009] Traditionally, the heat sinks are made of aluminum, which has good heat dissipation characteristics and such heat sink is traditionally installed on one side of a connection row. If a heat sink, including fins attached to a base, is screwed to one side of the connection row, the connection between the base and the connection row is generally not very good and may reduce heat dissipation. . However, aluminum is also electrically conductive. Therefore, since aluminum conducts electricity, it means that the heatsink itself must be kept in a protective case. Therefore, an additional fan box must be installed on the traditional heatsink-row connection arrangement. The IEC2006 industry standard requires that when a circuit breaker operates, the temperature difference between the temperature of the connection row and that of the ambient air is less than 80 K, so that not all materials are suitable for use. as heat sink. UTILITY MODEL CONTENT This utility model is for an integrated heat sink connection array module having a connection array with a melt-processable, double-sided, plastic heat sink comprising a base and fins, where the fins extend from the base, and I) the thermal conductivity of the plastic, when measured by ASTM 1461, in the range of 1 to 20 W / m * K in the plane and in the range of 0.5 to 2.0 W / m * K across the plane; II) the melting point of the plastic being greater than 200 ° C; III) plastic having a volume resistivity, when measured using the IEC60093 standard, of at least 1.0x108 Ohm * m. The double-sided heatsink is in two parts, one on each side of the connection row. The heat sink is installed on the connection row by means of at least one screw. The heat sink is installed on the connection row by means of a thermoconductive glue. The double-sided heatsink is overmolded on the connection row.
    [0010] The integrated heatsink connection row module is suitable for use with a molded case circuit breaker. Plastic is a semi-crystalline plastic. The plastic is a polyamide.
    [0011] The plastic comprises from 0.1 to 50% by weight, based on the total weight of the composition, of thermally conductive and electrically insulating fillers. The fins are straight fins. The fins are flared fins. The fins are pinned fins.
    [0012] The present utility model relates to a molded case circuit breaker having an integrated heat sink connection row module. This utility model relates to a circuit breaker where, when the circuit breaker is in operation, the temperature difference between the temperature of the connection row and that of the ambient air is less than 80 K.
    [0013] A generally recognized problem is that, when a circuit is interrupted, the energy must be transferred as quickly as possible to avoid overheating, particularly of the circuit breaker. In a conventional MCCB, an extruded aluminum heat sink with straight fins is attached to one side of a connection row with a screw. The heat sink may be manufactured by extruding aluminum or an aluminum alloy, as is well known in the state of the art. The use of a screw to connect the heatsink means that the connection and therefore the heat dissipation are not very good, because the use of screws limits the proximity of the connection. The use of screws 25 also occupies space that could be occupied by a fin. In addition, the aluminum is electrically conductive, so that a plastic cover with air vents is needed to cover the heat sink. In addition, one side of the connection row is apparent and therefore the cover is also necessary to protect people from electrical current flowing through the connection row. This means that a large number of processing steps are needed. In addition, it takes a lot more space to house the MCCB. This has been solved in the present utility model by the use of plastics, in particular by the use of a double-sided, melt processable heat sink comprising a base and fins, where the fins extend from the base, made, for example, by injection molding. An extrusion process is also suitable.
    [0014] The heat sink is therefore installed on both sides of the connection row, either as two separate pieces or by overmolding the heat sink on the connection row. An advantage of this design is that no cover is required for the integrated heatsink connection row module. The integrated heatsink connection row module, comprising a connection row and a melt processable heat sink, can be made together with the MCCB unit or can be conveniently made separately for retrofit repairs.
    [0015] Preferably, the melt processable plastic is an injection moldable plastic. Preferably, the meltable plastic is thermally conductive and electrically insulating. Thermally conductive polymer compositions typically include an organic polymer and a thermally conductive filler dispersed therein. However, thermally conductive charges which have a high thermal conductivity often also have a high electrical conductivity. Therefore, if the thermally conductive polymer composition is to be electrically insulating, the use of electrically conductive charges must be limited or excluded and must be replaced by electrically insulative charges. For the melt-processable plastic, thermoplastic polymers which can withstand high temperatures, such as polyamides, polyphenylene sulfides, polyphenylene oxides, polysulfones, are generally used. polyarylates, polyetheretherketones and polyetherimides. Representative examples include, but are not limited to, homopolyamides such as polyamide 6, polyamide 46, polyamide 56, polyamide 66, polyamide 410, polyamide 510, polyamide 610, polyamide 6T, polyamide 8T, polyamide 9T, polyamide1OT and the corresponding copolyamides, copolyamides of polyamide 6T, polyamide 8T, polyamide 9T and polyamide 10T with another polyamide, such as polyamide 4T, polyamide 5T, polyamide 7T, polyamide 12T, polyamide 46 and polyamide 66, as well as terpolymers, such as polyamide 6T / 4T / 46, [which is a polyamide 6T, polyamide 4T and polyamide 46 copolyamide] polyamide 6T / 66 / 46 [olyamide 6T, polyamide 66 and polyamide 46 copolyamide], polyamide 6T / 5T / 56 [olyamide 6T, polyamide 57 and polyamide 56 copolyamide] and polyamide 6T / 66/56 [olyamide copolyamide] 6T, polyamide 66 and polyamide 56]. Preferably, the polyamides are semi-crystalline or semi-aromatic polyamides. The polyamides may, for example, be based on 1,4-diaminobutane (symbol 4), 1,6-hexadiamine (symbol 6), terephthalic acid (symbol T) and adipic acid (symbol 6). More preferably, the polyamide is a terpolymer of 3 polyamides, the first polyamide being selected from the group consisting of polyamide 6T, polyamide 8T, polyamide 9T, polyamide 10T and polyamide 12T, the second polymer being selected from group consisting of polyamide 66, polyamide 86, polyamide 96, polyamide 106 and polyamide 126 and the third polyamide being selected from the group consisting of polyamide 4T and polyamide 5T.
    [0016] Even more preferably, the copolyamide is a terpolymer selected from the group consisting of polyamide 6T, polyamide 66 and polyamide 4T; polyamide 8T, polyamide 86 and polymer 4T; polyamide 9T, polyamide 96, polyamide 4T; and polyamide 10T, polyamide 106 and polyamide 4T. It is noted that the terpolymers can be named in different ways, depending on the ratio of the respective monomers used in the polyamides. For example, polyamide 6T / 66 / 4T, ie copolyamide of polyamide 6T, polyamide 66 and polyamide 4T, could also be called polyamide 4T / 6T / 46 or polyamide 6T / 4T / 46, depending on whether the content of polyamide 66 is greater or less than that of polyamide 4T.
    [0017] Suitable thermoconductive and electrically insulative fillers include boron nitride, since it has a relatively high intrinsic thermal conductivity and is electrically insulating. The boron nitride may be cubic boron nitride, hexagonal boron nitride, amorphous boron nitride, rhombohedral boron nitride or other allotrope. It can be used in the form of powder, agglomerates or fibers. Illustrative boron nitrides are PT350, PT360 and PT370, commercially available from General Electrics Advanced materials. Another thermally conductive filler includes carbon black and graphite. Carbon black is an amorphous particulate carbonaceous material that can be produced, for example, by oxidation of an oil. The filler, as such, is not electrically insulating and when used in large amounts can give thermally conductive compositions which are electrically insufficiently insulating. However, when used in lower amounts, in combination with other thermally conductive and electrically insulating fillers, it can significantly increase the thermal conductivity of the compositions, while still maintaining electrically insulating properties. Other suitable examples of thermally conductive, electrically insulating charges include coated metal spheres, aluminum oxide (Al 2 O 3), aluminum nitride (AlN), silicon carbide (SiC) and diamond.
    [0018] Preferably, the melt-processable, thermally conductive and electrically insulating plastic comprises from 0.1 to 50% by weight of thermally conductive and electrically insulating fillers, relative to the total weight of the composition. More preferably, the melt processable, thermally conductive and electrically insulating plastic comprises 15 to 40% by weight boron nitride and 0.01 to 10% by weight carbon black, based on the total weight of the composition. . In addition to boron nitride and carbon black, any material that can be dispersed in the organic polymer and that improves the thermal conductivity of the polymer composition can be used. Typically, such a material has an intrinsic thermal conductivity of at least 2.5 W / m * K. In addition to the electrically insulating thermoconductive charges, the electrically insulating composition may also comprise thermally conductive, electrically conductive charges, provided that the corresponding amount is sufficiently small to maintain the required electrically insulating properties of the composition. By "electrically insulating composition" is meant here a composition having a volume resistivity, measured by the method according to ASTM D257, of at least 105 Ohm * m. For the electrical volume resistivity test, test pieces of 80 x 80 x 2 mm are used. The test pieces are conditioned at 23 ° C. and at a relative humidity of 50% for 40 hours before the test. Preferably, the thermally conductive, electrically insulating plastic composition used in the invention has a volume resistivity of at least 108 Ohm * m.
    [0019] The melt processable plastic, like the composition comprising the melt processable plastic, is eminently suitable for forming products from the melt, for example by injection molding, extrusion, blow-molding or compression-molding.
    [0020] The composition comprising the melt processable plastic may comprise additives known to those skilled in the art for preparing such molding compositions. Suitable additives are, for example, stabilizers, such as UV stabilizers, thermal stabilizers and antioxidants, colorants, processing aids, for example mold release agents and lubricants, flow improvers. such as polyamide oligomers, impact-improving agents, fillers, reinforcing agents, such as carbon fibers and glass fibers, and flame retardants, such as halogen-containing flame retardants, halogen-free flame retardants and flame retardant synergists. The composition may optionally also contain polymers other than polyamides.
    [0021] Most preferably, the melt processable, thermally conductive, and electrically insulating plastic comprises StanylTM (available from DSM) having specific grades including grades TC153, TC155, TC154 and TC168, ArniteTM XLT AkulonTM TC185, TC186. Other examples of heat-resistant plastic include, but are not limited to, PA6 (from BASF, EMS, Lanxess, Solvay, KingFa), PA66 (from BASF, Dupont, Lanxess, Solvay, SABIC, Asahi, KingFa) , PA 9T (from Kururay), Zytel HTN (DuPont PA6T / 66 HTN), PA6T (from Solvay), PA6T / 10T and PA10T / 6T (from EMS and KingFa).
    [0022] An advantage of using a material such as StanylTM is that it not only has high heat dissipation properties, good temperature resistance and is electrically insulating, but also It has a high resistance to flammability while being light and can therefore also be used to reduce the thickness of the fins.
    [0023] BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 shows the technology of the prior art. In Figure 1, the heat sink is aluminum and is connected to one side of the connection row with screws. Figure 2 shows the technology of the prior art. In Figure 2, the heat sink is aluminum and is connected to one side of the connection row with screws. Figure 3 shows the embodiment 1, comprising a double-sided heat dissipation module and a connection row with a two-part heat sink, wherein each heat sink has straight fins extending from a base.
    [0024] Figure 4 shows the embodiment 2, comprising a double-sided heat dissipation module and a connection row with an overmolded dissipator with straight fins extending from a base. Figure 5 shows the embodiment 3, including a heat sink suitable for use as a double-sided heat sink with flared fins extending from a base. Figure 6 shows the embodiment 4, including a heat sink suitable for use as a double-sided heat sink with pin fins extending from a base. EMBODIMENTS FIG. 1 shows an integrated heat sink connection row module (1), comprising a connecting array (2) and a one-piece aluminum heat sink (3) with straight vanes. (5), where the heat sink is installed on one side with screws (9).
    [0025] FIG. 2 shows an integrated heatsink connection row module (1) including a connecting array (2) and an aluminum one-piece heatsink (3) with straight vanes (5), where the heatsink is installed on one side with screws (9). FIG. 3 shows an integrated heat sink connection row module (1) comprising a connection row (2) and a double-sided, two-piece, heat sink (3) (4) of transformable plastic in the state fused, with straight fins (5), where the heat sink is installed without the need for screws, but by the use of a heat-conducting glue (not shown). This will be called embodiment 1 in the following.
    [0026] FIG. 4 shows an integrated heatsink connection row module (1) including a connection row (2) and an overmolded plastic melt-convertible plastic heatsink (6) provided with straight fins (5). This will be called embodiment 2 in the following. FIG. 5 shows a meltable plastic heat sink (3) with flared fins (7) extending from a base (10) suitable for use as a double-sided heat sink . This will be called embodiment 3 in the following. Fig. 6 shows a heat sink (3) of molten transformable plastic having pin fins (8) extending from a base (10) suitable for use as a dual heat sink face. This will be called embodiment 4 in the following. Embodiment 1 A heat sink is manufactured by StanylTM TC155 polyamide injection molding available from DSM using standard compounding and mixing conditions for PA46 compounds. The mold is a housing comprising a main body and straight fin elements projecting inwardly from one side of the body. Two of these heat sinks are then installed, one on each side of a standard aluminum connection row using ST0802 conductive adhesive available from Silanex to provide a double sided heatsink.
    [0027] In use, the integrated heatsink connection row module (1) is connected to an MCCB. When the circuit breaker is in operation, the temperature difference between the temperature of the connection row and that of the ambient air is less than 70 K. The volume resistivity, when measured using the standard IEC60093, is greater than 1.0x108 Ohm * m.
    [0028] Embodiment 2 A heat sink is manufactured by injection molding of Akulon ™ TC 186 polyamide available from DSM using standard compounding and mixing conditions for PA46 compounds. The mold is a housing comprising a main body and straight fin elements projecting inwardly from both sides of the main body. The overmoulding provides a double-sided heat sink, installed on the connection row with complete contact between the connection row and the heat sink. In use, the integrated heatsink connection row module (1) is connected to an MCCB. When the circuit breaker is in operation, the temperature difference between the temperature of the connection row and that of the ambient air is less than 70 K. The volume resistivity, when measured using the IEC60093 standard, is greater than 1.0x108 Ohm * m.
    [0029] Embodiment 3 A heat sink with flared fins, suitable for use as a double-sided heat sink, is manufactured by injection molding of Stanyl ™ TC155 polyamide available from DSM using compounding and mixing conditions. standard for PA46 compounds. The mold is a housing comprising a main body and flaring wing elements projecting inwardly. The volume resistivity, when measured using the IEC60093 standard, is greater than 1.0x108 Ohm * m. Embodiment 4 The pinned fin heat sink, suitable for use as a double-sided heat sink, is manufactured by injection molding of Akulon ™ TC 186 polyamide available from DSM using compounding and metering conditions. standard mixture for PA46 compounds. The mold is a housing comprising a main body and pin fin elements projecting inwardly. The volume resistivity, when measured using IEC60093, is greater than 1.0x108 Ohm * m. 10
    权利要求:
    Claims (14)
    [0001]
    REVENDICATIONS1. An integrated heatsink connection row module comprising a connection row equipped with a melt-processable, double-sided, plastic heat sink including a base and vanes, where the vanes extend from the base, and I) the thermal conductivity of plastic, when measured by ASTM 1461, in the range of 1 to 20 W / m * K in the plane and in the range of 0, 5 to 2.0 W / m * K across the plane; II) the melting point of the plastic being greater than 200 ° C; III) plastic having a volume resistivity, when measured using the IEC60093 standard, of not less than 1,0x108 Ohm * m.
    [0002]
    An integrated heatsink connection row module according to claim 1, wherein the double-sided heatsink is in two parts, one on each side of the connection row.
    [0003]
    An integrated heat sink connection row module according to claim 2, wherein the heat sink portion is installed on the connection row by means of at least one screw.
    [0004]
    An integrated heatsink connection row module according to claim 2, wherein the heatsink portion is installed on the connection row by means of a thermoconductive glue.
    [0005]
    An integrated heat sink connection array module according to claim 1, wherein the double-sided heat sink is overmolded on the connection array.
    [0006]
    An integrated heat sink connection array module according to claim 1, suitable for use with a molded case circuit breaker.
    [0007]
    The integrated heat sink connection array module according to claim 1, wherein the plastic is a semi-crystalline plastic.
    [0008]
    An integrated heat sink connection row module according to claim 1, wherein the plastic is a polyamide.
    [0009]
    9. An integrated heat sink connection row module according to claim 1, the plastic comprising from 0.1 to 50% by weight, based on the total weight of the composition, thermally conductive and electrically insulating charges.
    [0010]
    An integrated heat sink connection row module according to claim 1, wherein the vanes are straight vanes.
    [0011]
    An integrated heat sink connection row module according to claim 1, wherein the vanes are flared vanes.
    [0012]
    The integrated heatsink connection row module of claim 1, wherein the fins are pinned fins.
    [0013]
    13. Molded case circuit breaker having an integrated heatsink connection row module as claimed in claim 1. 11 3027186
    [0014]
    A molded case circuit breaker having an integrated heatsink connection row module as claimed in claim 1, wherein, when the circuit breaker is in operation, the temperature difference between the temperature of the connection row and that of the Ambient air is less than 80 K. 5 12
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    同族专利:
    公开号 | 公开日
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    引用文献:
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    法律状态:
    2016-09-19| PLFP| Fee payment|Year of fee payment: 2 |
    2017-09-18| PLFP| Fee payment|Year of fee payment: 3 |
    2018-09-13| PLFP| Fee payment|Year of fee payment: 4 |
    2019-09-13| PLFP| Fee payment|Year of fee payment: 5 |
    2021-07-09| ST| Notification of lapse|Effective date: 20210605 |
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